Product Brochures

CSP 0.5mm Pitch Brochure
0.5 mm Pitch BGA CSP (PDF)
2 Pages
Logic Brochure
Logic (PDF)
February, 2008
6 Pages
Memory Brochure
Memory (PDF)
4 Pages

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Site Updated February 16, 2018

* * * Sensata > Products > Burn-in Sockets >

IC Burn-in Test Socket Product Overview
Solutions for the Industry’s Most Demanding CSP Requirements

Whether you are looking from our existing portfolio of burn-in test sockets or a custom CSP solution, Sensata offers unmatched capacity, worldwide bandwidth and manufacturing flexibility. Our global workforce is ready to partner with you to find the best solution, no matter what you need.

I/O Chart

24/7 Worldwide Support
CSP Leaders
Interconnect Since 1970

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Contact a product specialist.

0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!


Tel: 1-508-236-1868





BGA Series IC Burn-In Test Sockets
Ball Grid Array Packages
LGA IC Burn-In Test Sockets
Land Grid Array Packages
QFP IC Burn-In Test Sockets
Quad Flat Pack Packages

The future is clear... More I/O at smaller sizes.
Our team creates next generation sockets so that we have the best solution, at the right time, to meet your semiconductor socket needs.
The World Depends on Sensors and Controls